Linco Technlology is a company founded in 1999, with a professional technical team from fields such as semiconductor, IC packaging, and optoelectronics. We focus on the development of core technology, process equipment, and the research and development of heat dissipation modules. The company's products include advanced semiconductor packaging, carrier materials, displays, heat dissipation substrates, green energy technology, and more.
In 2010, Linco Technlology created a conformal shielded sputtering equipment for SiP system packaging, which has been applied in multiple industries. In addition, Linco Technlology has expanded its investment in contract manufacturing business, focusing on the development of semiconductor materials for heat dissipation substrates, and promoting the domestic industry's technological upgrade and development by replacing the existing wet process with a dry and eco-friendly process. Linco Technlology has become the world's largest supplier of semiconductor system-level packaging (SiP) sputtering equipment and a world-class benchmark.
The company adheres to the goal of "zero emissions of green energy" and aims to achieve it through the implementation of the "Net Zero Carbon Emissions by 2050" policy. Linco Technlology was one of the fastest-growing 50 companies in 2021 according to Common Wealth Magazine, and provides high-quality and reliable process equipment and technical support services. We have been recognized as a distinguished supplier by USI in 2015, an outstanding strategic partner by ASE in 2020, and the recipient of the 2022 Central Taiwan Science Park Innovation Product Award.
Main products and services
1.SiP Electromagnetic Shielding Coating Equipment for Advanced Semiconductor Packaging
2.Backside Metalization /RDL/Substrate Seed Layer Sputtering Equipment for Advanced Semiconductor Packaging
3.Flexible Substrate Sputtering Equipment for Transparent Conductive Oxide (TCO) Coating
4.Plasma Cleaning and Dry Etching Equipment
5.In-house Production of Ceramic Substrate Materials for Heat Dissipation
Information
| | Linco technology Co., Ltd. |
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| | No. 16, Keyuan 1st Rd., Xitun Dist., Taichung City , Taiwan (R.O.C.) |
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