FitTech provides laser precision processing equipment for semiconductor and PCB industries, such as cutting, drilling, scribing, engraving, and cleaning.
For materials like ceramics and silicon, cutting, scribing, and drilling equipment are available. For the PCB industry, drilling and cutting equipment for FPCB, BT, and ABF boards are provided. In the engraving segment, equipment for wafer engraving of materials like Si, SiC, GaAs, GaN, Strip engraving, and Tray engraving are available.
FitTech provides laser precision processing equipment for semiconductor and PCB industries, such as cutting, drilling, scribing, engraving, and cleaning.
For materials like ceramics and silicon, cutting, scribing, and drilling equipment are available. For the PCB industry, drilling and cutting equipment for FPCB, BT, and ABF boards are provided. In the engraving segment, equipment for wafer engraving of materials like Si, SiC, GaAs, GaN, Strip engraving, and Tray engraving are available.
Additionally, laser cleaning equipment is one of FitTech's key products. Compared to traditional cleaning methods, laser cleaning can clean without damaging the substrate. Equipment includes handheld, machine-based, or integrated cobot options for cleaning different products.
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