Sputter system equipment|TEEIA B2B SOLUTION ONLINE

Sputter system equipment

Manufacturer：UVAT Technology Co., Ltd.

→Product Description
•Inline Sputter system
•Advanced packaging process:
-UBM(Under Bump Metallurgy)
-RDL(Redistribution Layer)
-Sputter Ti/Cu seed layer

→Equipment characteristic
•Low temperature sputtering process
•Low output time/high capacity design
•Good sidewall coverage
•Good film adhesion
•Vehicle automatic return system

DETAILS

→Product Description
•Inline Sputter system
•Advanced packaging process:
-UBM(Under Bump Metallurgy)
-RDL(Redistribution Layer)
-Sputter Ti/Cu seed layer

→Equipment characteristic
•Low temperature sputtering process
•Low output time/high capacity design
•Good sidewall coverage
•Good film adhesion
•Vehicle automatic return system

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