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Appointment
Manufacturer
Application Field:
SiP EMI Shielding
BSM, BGBM
FO-PLP/RDL
Coreless Substrate
Non-plating Line
Fine Line Seed Layer Ti-Cu
High Frequency Flexible Substrate
TCO/ITO Sputter
Solar Collector Sputtering
Characteristics
- Horizontal sputtering deposition.
- Modular based chamber design.
- High reliable isolation valve design.
- High efficiency plasma source and uniform gas flow conductance design.
- High target utilization of magnetron cathode design.
- Low temperature process.
- User-friendly Human-Machine Interface design with industrial PC.
- Oil free vacuum pump configuration.
- Power supply, cathode and vacuum safety interlock.
- Equipped with automatic carrier-return conveyer for compact foot print.
- Film Thickness Non-uniformity: 5~10%, based on process.
- Process Temperature: ≦ 200℃, based on process.
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