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Appointment
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End-Product:
Advanced Packaging
IC Carrier/ Printed Circuit Boards/ Wafer
Fan-Out Wafer-Level Packaging (FOWLP)
Fan-Out Panel-Level Packaging (FOPLP)
Application:
- Surface plasma cleaning and modification (hydrophilic or hydrophobic))
- Substrate cleaning before wire bonding, UF and molding
- Desmear for removing residual resin
- Descum for removing photoresist/residual glue
- Thin down of dielectric materials (e.g. Black matrix, photoresist, ABF)
- Metal or dielectric materials dry etching.
- Blind via and blind via bottom cleaning
- Improving interlayer adhesion
Characteristics
- High-Density Plasma (HDP) source with high concentration of free radicals enables high throughput and high etch rate.
- Combination of High-Density Plasma (HDP) and radio frequency CCP-RIE processes provides flexible process capabilities.
- CFD-optimized showerhead design allows for uniform gas distribution.
- Seamless process parameter operation enables wide chemical composition tuning.
- Process chamber temperature control reduces unwanted gas condensation and by-product accumulation on chamber walls.
- Excellent exhaust system design improves etch uniformity and process repeatability.
- APC automatic pressure valve module.
- Plasma source module with integrated and monitored feedback signals and OES end-point detector enables real-time process monitoring and contaminant detection.
- Pedestal temperature monitoring mechanism.
- Configured with oil-free vacuum pumps. Power, vacuum and water flow safety interlocks.
- ESD electrostatic protection.
- Human-machine interface compliant with SEGS-GEM specifications.
Etching non-uniformity <10%, based on process.
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