Plasma Dry Etch Equipment

→Product Description
•Horizontal Plasma Etch Equipment
•Plasma Dry Etch
•Plasma Thin down
•Plasma Desmear
•Plasma Descum
•Plasma Pre-treatment
 
→Equipment characteristic
•High-speed dry etching process
•High etching uniformity
•Modular design to achieve low cost/low footprint
•Advanced packaging(Panel Fan-Out FOPLP/FOWLP)
•High-end carrier board application technology
•With semiconductor-grade EFEM configuration​​​​​​​