Hortech developed the ultrafast DUV deep ultraviolet laser machines with large power. These machines are capable of implementing multiple processes for diverse applications.
Recently, Hortech developed the ultrafast DUV deep ultraviolet laser machines with large power. These machines are capable of implementing multiple processes for diverse applications. Specifically, these can be used for:
The 3D silicon stacking and advanced packaging of semiconductors, including micro-drilling on ABF and BT substrates;
Power MOSFET circuit by laser direct micro-etching;
The lift-off, mass transfer, and micro-cutting LEDs in the MicroLED production process, together with plasma vertical cutting machines, can replace the stealth wafer dicing process. Hortech also developed the waterjet laser machines for cutting hard materials, including compound semiconductors (e.g., SiC, GaN), diamond, and sapphire. Hortech also produce optical scales for encoders, including drum scales, linear scales, and disc scales.
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