Automated Vapor Deposition Loader and Inspection Equipment

E-Gun Evaporation System Combined with Automated Wafer Handling and Inspection Equipment: Enhancing Competitiveness in Third-Generation Semiconductor Applications
Our cutting-edge E-Gun evaporation system, integrated with automated wafer handling and inspection equipment, offers significant competitive advantages in third-generation semiconductor applications. These advantages include high-quality thin film deposition, precision in uniformity control, reduced contamination, and streamlined labor efficiency. Below are the key functions and features of our equipment:

Key Functions:

• Designed for wafer operations on E-Gun evaporation equipment:
  • Supports wafer sizes of 4”, 6”, and 8” (customized for a single size)
  • Enhances the accuracy of wafer loading and unloading in evaporation boats, replacing manual operations
  • Precise edge alignment and recalibration during wafer placement
  • OCR ID registration (optional QR code support)
  • Edge chipping and breakage inspection (through-type)
  • CST Mapping to detect misplacement (double stacking, cross-slotted wafers)
  • All operational results can be transmitted to MES via SECS/GEM for production history tracking (customizable format)

Distinctive Features:

• Utilizes a 3-axis laser system for millisecond-level flatness measurement of the evaporation plate, ensuring repeatable and highly precise loading and unloading. This minimizes the risk of wafer breakage and misplacement, particularly in processes involving increasingly thinner and more fragile wafers.
• Records wafer ID placement on the evaporation plate and boat ID, providing raw production data for big data analysis, eliminating yield blind spots.
• Unique evaporation plate fixation method ensures both automation and reliability, addressing the uneven pressure issue caused by traditional spring-loaded structures.
• Employs a 6-axis robotic arm with multi-plane operation capabilities, enabling precise and highly repeatable loading and unloading on different 3D planes of the evaporation boat.
• Uses a small spot laser sensor for mapping, with proprietary algorithms to reliably detect wafers with a thickness of 0.2mm or above.
• The entire machine features multi-porous Peek suction cups (made of the same material as FOUP and CST), reducing contamination and wafer damage.
• SECS/GEM software is self-developed, tailored for 12" (300mm) wafer equipment automation, free from the constraints of commercially available software formats.
• SECS/GEM offers both standalone and API versions, compatible with .NET Core/.NET 6 or higher. The system integrates seamlessly with high-performance PLC systems, providing efficient data communication and control between equipment, making it the ideal choice for ensuring flexible and stable operation.