GTR-1215 is equipped with the core technology of a hydrostatic spindle and rotary table made by Grintimate, which has the advantages of high rigidity and high precision. It is especially suitable for compound semiconductors or reclaimed wafer grinding. It is also easy to operate, fully functional, and cost-effective. It adopts manual loading mode, equipped with an automatic thickness measurement system and automatic compensation system, which can automatically grind to the target size accurately. With a hydrostatic spindle and a worktable, GTR-1215 can meet the processing applications of 4"-12" diversified products.
GTR-1215 is equipped with the core technology of a hydrostatic spindle and rotary table made by Grintimate, which has the advantages of high rigidity and high precision. It is especially suitable for compound semiconductors or reclaimed wafer grinding. It is also easy to operate, fully functional, and cost-effective. It adopts manual loading mode, equipped with an automatic thickness measurement system and automatic compensation system, which can automatically grind to the target size accurately. With a hydrostatic spindle and a worktable, GTR-1215 can meet the processing applications of 4"-12" diversified products.
Online Monitor of Grinding status, prevent the wafer from being deformed and damaged.
Chuck table could be customized according to the needs of different sizes wafers.
Real-time monitoring of wafer thickness and automatic correction to ensure the accuracy of wafer thickness.
Achieve 300mm Si wafer thinning thickness <30µm, TTV <2µm, Ra 0.01µm
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