Semiconductor Related Solutions

Semiconductor Related Solutions

Manufacturer:FEEDBACK TECHNOLOGY CORP.

(1) Micro/Nano Functional Coating Technology
(2) High Aspect Ratio Coating Technology
(3) Graphite Particle-Control Technology
(4) Electron Beam Welding Technology
(5) Third-Generation Semiconductor Material Processing Technology
(6) E-Chuck Cleaning and Restoration Technology
DETAILS


(1) Micro/Nano Functional Coating Technology

Thermal spray and high-pressure cold spray coating technologies have been widely applied in areas like plasma resistance, corrosion protection, high insulation, thermal barriers, and wear-resistant coatings. Feedback Technology has secured numerous patents for material coatings in this field, and its solutions are implemented in advanced manufacturing equipment for leading local companies. These coatings have reduced particle contamination by 90% while solving the issue of plasma corrosion that leads to layer peeling.

(2) High Aspect Ratio Coating Technology

Technologies like Atomic Layer Deposition (ALD), Plasma-Enhanced Chemical Vapor Deposition (PECVD), and chemical immersion plating produce monocrystalline coatings several hundred nanometers thick, without limitations imposed by geometry. They enable uniform and dense film deposition on complex structures such as micropores and PINs. By combining these techniques with annealing heat treatment, the monocrystalline layer becomes densified, reducing the likelihood of peeling, while eliminating substrate stress and enhancing the physical and chemical stability of the coatings.

(3) Graphite Particle-Control Technology

In advanced manufacturing processes, controlling the cleanliness of the chamber is critical for yield management, as controlling contamination directly impacts product yield. Graphite components around the ion source of ion implanters are often the primary contamination source. Feedback Technology’s graphite particle-control technology quickly and effectively reduces graphite contamination, eliminating the need for manual cleaning and additional costs associated with the disposal of residual waste liquids. This also aligns with ESG principles.

(4) Electron Beam Welding Technology

Electron beam welding technology is widely applied in semiconductor equipment chamber manufacturing and other fields. It can significantly reduce weld seam oxidation and other contaminants, offering the advantages of high cleanliness and strong weld strength. Additionally, electron beam welding provides high penetration and a small heat-affected zone, making it ideal for butt joints, T-joints, lap joints, and especially for cases where joints are constrained by structural limitations. We have the most advanced equipment and technology, allowing for precise control of the electron beam and its oscillation to perform complex and accurate welds. Our large vacuum chambers can accommodate workpieces over 1 meter in length, suitable for most metals and capable of welding dissimilar material.

(5) Third-Generation Semiconductor Material Processing Technology

Feedback Technology has developed third-generation semiconductor material processing techniques, introducing ultra-fast femtosecond laser processing technology which can meet future client demands for specialty material processing.

(6) E-Chuck Cleaning and Restoration Technology

In semiconductor equipment, E-Chucks often face operational issues requiring unscheduled downtime. Feedback Technology’s innovative solution offers surface restoration for E-Chucks, significantly reducing customer costs and turnaround time.
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