Hot Plate / Cooling Plate|TEEIA B2B SOLUTION ONLINE

Hot Plate / Cooling Plate

Manufacturer：WAH LEE INDUSTRIAL CORP.

Hot Plate/Cooling Plate Machine for FOPLP/FOWLP
Offers Baking Machines for Various Process Requirements: Suitable for Dehydration Bake, Soft Bake, Hard Bake, etc.
Accommodates Different Substrate Sizes: Compatible with substrates of 510x515mm, 300x300mm, 600x600mm, 12"Wafer, etc.
High-Performance Temperature Control.Standard temperature accuracy is≦ 150℃ with a tolerance of +2.5℃. Maximum temperature can reach up to 250℃.
Panel Warpage Solution: Provides solutions to address panel warpage issues, ensuring uniform temperature distribution and preventing uneven heating caused by warpage.

DETAILS

Hot Plate/Cooling Plate Machine for FOPLP/FOWLP
Offers Baking Machines for Various Process Requirements: Suitable for Dehydration Bake, Soft Bake, Hard Bake, etc.
Accommodates Different Substrate Sizes: Compatible with substrates of 510x515mm, 300x300mm, 600x600mm, 12"Wafer, etc.
High-Performance Temperature Control.Standard temperature accuracy is≦ 150℃ with a tolerance of +2.5℃. Maximum temperature can reach up to 250℃.
Panel Warpage Solution: Provides solutions to address panel warpage issues, ensuring uniform temperature distribution and preventing uneven heating caused by warpage.

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